◎ SnAg3.0% GB/T20422-2006 chemical composition of lead-free solder
Melting temperature ℃
Chemical composition (mass fraction)%
The total amount of impurities
* Our factory lead-free solder wire lead (Pb) content below national standards
◎ JL-SnAg3.0 is a binary tin-silver lead-free solder alloy, its standard silver content of 3.0% and the balance tin; subsection lead-free solder has a good wettability during the soldering process, solder smooth round high joint strength, particularly good resistance to creep fatigue performance characteristics, because the product does not contain copper (Cu), especially suitable for the use SnAg3.0Cu0.5 (SAC305) alloy soldering added, while reducing copper content increases. For lead-free electronics equipment commonly associated in the brazing material.